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AIP World Congress

Dansensor will participate at the World Congress and Exhibition on Active & Intelligent Packaging in Nuernberg, Germany 23 - 25 September 2013.

Meet us in the High Tech Demonstration Area for a MAP talk.

We look forward to seeing you there. Further information about the event
  • Active & Intelligent Pacakaging Industry Association

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Send us your contact details and you will receive a quote from our nearest distributor.
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